Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/24/1992
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Application #:
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07674249
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Filing Dt:
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03/25/1991
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Inventors:
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JAMES R. BENTLAGE, DAVID E. ENGLE, GEOFFREY R. MARINER, JOHN J. SQUIRES et al
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Title:
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ELECTRONIC PACKAGE FOR HIGH DENSITY APPLICATIONS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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LAWRENCE R. FRALEY |
IBM CORP., DEPT. N50, BLDG. 251-2 |
1701 NORTH ST. |
ENDICOTT, NY 13760 |
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