Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/07/1992
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Application #:
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07785665
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Filing Dt:
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10/31/1991
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Inventors:
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ANGUS C. FOX III, WARREN M. FARNWORTH
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Title:
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HIGH-DENSITY ELECTRONIC PACKAGE COMPRISING STACKED SUB-MODULES WHICH ARE ELECTRICALLY INTERCONNECTERD BY SOLDER-FILLED VIAS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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2805 E. COLUMBIA ROAD, BOISE, ID 83706 |
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ANGUS C. FOX III |
MICRON TECHNOLOGY, INC. |
2805 E. COLUMBIA RD. |
BOISE, ID 83706 |
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