Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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08/04/1992
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Application #:
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07765286
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Filing Dt:
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09/25/1991
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Inventors:
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VICTOR A. K. TEMPLE, DONALD L. WATROUS, CONSTANTINE A. NEUGEBAUER, JAMES F. BURGESS et al
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Title:
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METHOD OF FORMING HERMETIC PACKAGE HAVING A LEAD EXTENDING THROUGH AN APERTURE IN THE PACKAGE LID PACKAGED SEMICONDUCTOR CHIP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2401 PALM BAY ROAD, N.E. |
| PALM BAY, FLORIDA 32905 |
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| FISH & RICHARDSON |
| TIMOTHY A. FRENCH |
| 225 FRANKLIN STREET |
| BOSTON, MA 02110-2804 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11 MADISON AVENUE |
| NEW YORK, NEW YORK 10010 |
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| CRAVATH, SWAINE & MOORE |
| CHIANN BAO |
| WORLDWIDE PLAZA, 44TH FLOOR |
| 825 EIGHTH AVENUE |
| NEW YORK, NY 10019 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 252 WELSH POOL ROAD |
| EXTON, PENNSYLVANIA 19341 |
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| BLANK, ROME, COMISKY & MCCAULEY LLP |
| TIMOTHY D. PECSENYE, ESQUIRE |
| ONE LOGAN SQUARE |
| PHILADELPHIA, PA 19103 |
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