Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/22/1992
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Application #:
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07889008
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Filing Dt:
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05/26/1992
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Inventors:
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LARRY D. KINSMAN, DEREK J. GOCHNOUR
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Title:
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SOFT BOND FOR SEMICONDUCTOR DIES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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2805 E. COLUMBIA ROAD |
BOISE, IDAHO 83706 |
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STANLEY N. PROTIGAL |
MICRON TECHNOLOGY, INC. |
2805 EAST COLUMBIA ROAD |
BOISE, ID 83706 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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26 DEER CREEK LANE |
MT. KISCO, NEW YORK 10549 |
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CHRISTOPHER C. HENRY |
ROPES & GRAY LLP |
1211 AVENUE OF THE AMERICAS |
NEW YORK, NEW YORK 10036 |
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