Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/26/1993
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Application #:
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07804614
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Filing Dt:
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12/02/1991
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Inventors:
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RICHARD L. BECHTEL, MAMMEN THOMAS, JAMES W. HIVELY
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Title:
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HIGH DENSITY MULTICHIP PACKAGEWITH INTERCONNECT STRUCTURE AND HEATSINK
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Assignment:
1
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 333 WEST SANTA CLARA STREET |
| SAN JOSE, CALIFORNIA 95113 |
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| GRAY CARY WARE & FREIDENRICH |
| ERIN O'BRIEN |
| 400 HAMILTON AVENUE |
| PALO ALTO, CALIFORNIA 94301 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| THREE PALO ALTO SQUARE, SUITE 150 |
| PALO ALTO, CALIFORNIA 94303 |
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| ERIN O'BRIEN |
| GRAY CARY WARE & FREIDENRICH |
| 4365 EXECUTIVE DRIVE |
| SAN DIEGO, CA 92121-2133 |
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