Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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02/02/1993
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Application #:
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07603495
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Filing Dt:
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10/26/1990
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Inventors:
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CONSTANTINE A. NEUGEBAUER, HOMER H. GLASCOCK II, KYUNG W. PAIK, JAMES G. MC MULLEN
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Title:
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DIRECT THERMOCOMPRESSION BONDING FOR THIN ELECTRONIC POWER CHIPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| GENERAL ELECTRIC COMPANY |
| CRD PATENT DOCKET RM 4A59 |
| P. O. BOX 8, BLDG. K-1- SALAMONE |
| SCHENECTADY, NY 12301 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2401 PALM BAY ROAD, N.E. |
| PALM BAY, FLORIDA 32905 |
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| FISH & RICHARDSON |
| TIMOTHY A. FRENCH |
| 225 FRANKLIN STREET |
| BOSTON, MA 02110-2804 |
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Assignment:
3
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11 MADISON AVENUE |
| NEW YORK, NEW YORK 10010 |
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| CRAVATH, SWAINE & MOORE |
| CHIANN BAO |
| WORLDWIDE PLAZA, 44TH FLOOR |
| 825 EIGHTH AVENUE |
| NEW YORK, NY 10019 |
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