Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/04/1994
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Application #:
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08046052
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Filing Dt:
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04/12/1993
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Inventors:
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PHILLIP D. ISAACS, GREGG A. KNOTTS, MILES F. SWAIN, BURTON A. TOWNE
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Title:
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SOLDER BALL CONNECT PAD-ON-VIA ASSEMBLY PROCESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| INTELLECTUAL PROPERTY LAW |
| OLD ORCHARD RD. |
| ARMONK, NEW YORK 10504 |
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| LAURENCE R. LETSON |
| 2468 HEATHER CT. |
| LEXINGTON, KY 40503 |
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