Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/04/1994
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Application #:
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07883082
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Filing Dt:
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05/15/1992
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Inventors:
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KLAUS D. BEYER, CHANG-MING HSIEH, LOUIS LU-CHEN HSU, TSORNG-DIH YUAN
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Title:
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BONDED WAFER STRUCTURE HAVING A BURIED INSULATION LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| A CORPORATION OF NEW YORK |
| ARMONK, NEW YORK 10504 |
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| IBM CORPORATION |
| DEPT. 901, BLDG. 300-482 |
| HOPEWELL JUNCTION, NY 12533 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| OLD ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| IBM CORPORATION |
| MICHAEL BALCONI-LAMICA |
| DEPT. 18G, BLDG. 300-482 |
| 1580 ROUTE 52 |
| HOPEWELL JUNCTION, NY 12533-6531 |
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