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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
12/13/1994
Application #:
08034339
Filing Dt:
03/19/1993
Inventors:
TRUNG T. DOAN, RANDHIR P.S. THAKUR, YAUH-CHING LIU
Title:
APPROACH TO AVOID BUCKLING IN BPSG BY USING AN INTERMEDIATE BARRIER LAYER
Assignment: 1
Reel/Frame:
006574/0073Recorded: 03/19/1993Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/17/1993
Exec Dt:
03/17/1993
Exec Dt:
03/19/1993
Assignee:
MAIL STOP #507 PATENT DEPARTMENT
2805 E. COLUMBIA ROAD
BOISE, IDAHO 83706
Correspondent:
OZER M. N. TEITELBAUM
MAIL STOP #507
PATENT DEPARTMENT
2805 E. COLUMBIA ROAD
BOISE, ID 83706
Assignment: 2
Reel/Frame:
006945/0397Recorded: 02/07/1994Pages: 5
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT ASSIGNEE'S STATE OF INCORPORATION. AN ASSIGNMENT WAS PREVIOUSLY RECORDED AT REEL 6574, FRAME 0073.
Assignors:
Exec Dt:
03/17/1993
Exec Dt:
03/17/1993
Exec Dt:
03/19/1993
Assignee:
2805 E. COLUMBIA RD. MS 507
BOISE, IDAHO 83706-9698
Correspondent:
MICRON SEMICONDUCTOR, INC.
WILLIAM R. BACHAND
2805 EAST COLUMBIA RD. MS 507
BOISE, ID 83706-9698
Assignment: 3
Reel/Frame:
029445/0573Recorded: 12/11/2012Pages: 11
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/27/1994
Assignee:
8000 SOUTH FEDERAL WAY
BOISE, IDAHO 83716
Correspondent:
MICRON TECHNOLOGY, INC
C/O BLACKHILLSIP
121 S 8TH STREET; SUITE 800
MINNEAPOLIS, MN 55402

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