Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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01/03/1995
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Application #:
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08021271
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Filing Dt:
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02/22/1993
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Inventor:
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DAVID F. CHEFFINGS
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Title:
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ELECTRICALLY CONDUCTIVE SUBSTRATE INTERCONNECT CONTINUITY REGION AND METHOD OF FORMING SAME WITH AN ANGLED IMPLANT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 2805 EAST COLUMBIA ROAD |
| LEGAL DEPT., MS 507 |
| BOISE, IDAHO 83706 |
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| MICRON SEMICONDUCTOR, INC. |
| SUSAN B. COLLIER, PATENT AGENT |
| LEGAL DEPT., MS 507 |
| 2805 EAST COLUMBIA ROAD |
| BOISE, ID 83706 |
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Assignment:
2
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CORRECTED ASSIGNMENT FRAME: 6471 AND REEL: 0238
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| 2805 EAST COLUMBIA ROAD |
| MS507 |
| BOISE, IDAHO 83706 |
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| SUSAN B. COLLIER |
| PATENT AGENT, MS507 |
| 2805 EAST COLUMBIA ROAD |
| BOISE, ID 83706 |
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Assignment:
3
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 8000 SOUTH FEDERAL WAY |
| BOISE, IDAHO 83716 |
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| MICRON TECHNOLOGY, INC |
| C/O BLACKHILLSIP |
| 121 S 8TH STREET; SUITE 800 |
| MINNEAPOLIS, MN 55402 |
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