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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
5466634
Issue Dt:
11/14/1995
Application #:
08359982
Filing Dt:
12/20/1994
Inventors:
KENNETH E. BEILSTEIN JR., CLAUDE L. BERTIN, JOHN E. CRONIN, ROBERT B. PHILLIPS et al
Title:
ELECTRONIC MODULES WITH INTERCONNECTED SURFACE METALLIZATION LAYERS AND FABRICATION METHODS THEREFORE
Assignment: 1
Reel/Frame:
007393/0077Recorded: 03/13/1995Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
BEILSTEIN, KENNETH E., JR.
Exec Dt:
12/16/1994
BERTIN, CLAUDE L.
Exec Dt:
12/16/1994
CRONIN, JOHN E.
Exec Dt:
12/16/1994
HOWELL, WAYNE J.
Exec Dt:
12/15/1994
LEAS, JAMES M.
Exec Dt:
12/15/1994
PHILLIPS, ROBERT B.
Exec Dt:
12/27/1994
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
OLD ORCHARD ROAD ARMONK, NY 10504
NEW YORK
Correspondent:
KEVIN P. RADIGAN
HESLIN & ROTHENBERG, P.C.
5 COLUMBIA CIRCLE
ALBANY NY 12203

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