Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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02/27/1996
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Application #:
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08361062
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Filing Dt:
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12/19/1994
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Inventors:
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BRUCE E. KORNFELD, ARTHUR R. ALEXANDER
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Title:
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THREE DIMENSIONAL DIE PACKAGING IN MULTI-CHIP MODULES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| LAW DEPARTMENT |
| 1700 S. PATTERSON BLVD. |
| DAYTON, OHIO 45479 |
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| JAMES M. STOVER |
| LAW DEPARTMENT |
| 1700 S. PATTERSON BLVD. |
| DAYTON, OH 45479 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| LAW DEPT., ECD-2 |
| 101 W. SCHANTZ AVE. |
| DAYTON, OHIO 45479 |
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| DOUGLAS S. FOOTE |
| LAW DEPARTMENT, ECD-2 |
| 101 W. SCHANTZ AVE. |
| DAYTON, OHIO 45479-0001 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 171 MAIN STREET, #271 |
| LOS ALTOS, CALIFORNIA 94022 |
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| MICHAEL V. MESSINGER |
| 1100 NEW YORK AVENUE, NW |
| WASHINGTON, DC 20005 |
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Assignment:
4
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 2711 CENTERVILLE RD., SUITE 400 |
| WILMINGTON, DELAWARE 19808 |
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| STERNE, KESSLER, GOLDSTEIN & FOX |
| 1100 NEW YORK AVENUE, N.W. |
| WASHINGTON, DC 20005 |
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