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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/18/1997
Application #:
08541848
Filing Dt:
10/10/1995
Inventor:
ANTHONY M. PALAGONIA
Title:
SEMICONDUCTOR CHIP HIGH DENSITY PACKAGING
Assignment: 1
Reel/Frame:
007682/0431Recorded: 10/10/1995Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/04/1995
Assignee:
OLD ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
THORNTON & THORNTON
FRANCIS J. THORNTON
RD # 1, BOX 1105
CHARLOTTE, VERMONT 05445

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