Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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10/14/1997
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Application #:
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08436522
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Filing Dt:
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05/08/1995
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Inventors:
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JERROLD L KING, JERRY M BROOKS
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Title:
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SEMICONDUCTOR CHIP PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MAIL STOP 507 |
| 2805 E. COLUMBIA ROAD |
| BOISE, IDAHO 83706 |
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| FIRST INTERSTATE CENTER |
| STEVEN R. ORMISTON |
| 877 W. MAIN ST., STE. 507 |
| P.O. BOX 2894 |
| BOISE, ID 83701 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HWA-YA TECHNOLOGY PARK NO. 669, FUHSING 3 RD |
| KUEISHAN, TAOYUAN, TAIWAN |
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| DORSEY & WHITNEY LLP - IP DOCKET DEPT. |
| 701 FIFTH AVENUE |
| SUITE 6100 |
| SEATTLE, WA 98104-7043 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HWA-YA TECHNOLOGY PARK NO. 669, FUHSING 3 RD |
| KUEISHAN, TAOYUAN, TAIWAN |
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| DORSEY & WHITNEY LLP - IP DOCKET DEPT. |
| 701 FIFTH AVENUE |
| SUITE 6100 |
| SEATTLE, WA 98104-7043 |
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