Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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11/25/1997
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Application #:
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08060902
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Filing Dt:
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05/13/1993
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Inventors:
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DAVID S. BECKER, GUY T. BLALOCK
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Title:
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IN SITU ETCH PROCESS FOR INSULATING AND CONDUCTIVE MATERIALS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MAIL STOP 507 PATENT DEPARTMENT |
| 2805 E. COLUMBIA ROAD |
| BOISE, IDAHO 83706 |
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| LIA M. PAPPAS |
| MAIL STOP 507 |
| PATENT DEPARTMENT |
| 2805 E. COLUMBIA ROAD |
| BOISE, ID 83706 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE STATE OF INCORPORATION FOR THE ASSIGNEE. PREVIOUSLY RECORDED ON REEL 6536/FRAME 987-989.
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| PATENT DEPT., MS507 |
| 2805 EAST COLUMBIA ROAD |
| BOISE, IDAHO 83706 |
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| LIA M. PAPPAS |
| 2805 EAST COLUMBIA ROAD |
| BOISE, ID 83706 |
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Assignment:
3
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 8000 S. FEDERAL WAY |
| BOISE, IDAHO 83706 |
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| MICRON TECHNOLOGY, INC. |
| WALTER D. FIELDS |
| PATENT DEPT., MAIL STOP 525 |
| 8000 S. FEDERAL WAY |
| BOISE, ID 83706-9632 |
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Assignment:
4
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 8000 S. FEDERAL WAY |
| BOISE, IDAHO 83706 |
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| MICRON TECHNOLOGY, INC. |
| WALTER D. FIELDS |
| 8000 S. FEDERAL WAY |
| BOISE, IDAHO 83706-9632 |
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