Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/02/1997
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Application #:
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08779025
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Filing Dt:
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01/06/1997
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Inventors:
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FEREYDOUN MAALI, LEONARD J. POCH, GEORGE E. HICKOK
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Title:
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SYSTEM AND METHOD FOR LOCATING SOLDER BUMPS ON SEMICONDUCTOR CHIPS OR CHIP CARRIERS
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1403 FOULK ROAD, SUITE 102 |
WILMINGTON, DELAWARE 19803 |
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ORRICK, HERRINGTON & SUTCLIFFE LLP |
BRADFORD BREEN |
666 FIFTH AVENUE |
NEW YORK, NY 10103 |
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