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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
02/17/1998
Application #:
08546216
Filing Dt:
10/20/1995
Inventors:
JOHN N. BOUCHER, DAVID E. BAJUNE
Title:
SEMICONDUCTOR WAFER DICING METHOD
Assignment: 1
Reel/Frame:
012698/0626Recorded: 03/26/2002Pages: 45
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/29/1996
Assignee:
600 MOUNTAIN AVENUE
MURRAY HILL, NEW JERSEY 07974
Correspondent:
DOCKET ADMINISTRATOR
BRIAN K. DINICOLA
101 CRAWFORDS CORNER ROAD, ROOM 1L-202
P.O. BOX 9629
HOLMDEL, NJ 07733-3030
Assignment: 2
Reel/Frame:
013438/0182Recorded: 10/30/2002Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/22/2002
Exec Dt:
10/22/2002
Assignee:
391 MELODY LANE
CASSELBERRY, FLORIDA 32707
Correspondent:
ALLEN, DYER, DOPPELT, ET AL.
HERBERT L. ALLEN
255 SOUTH ORANGE AVENUE, SUITE 1401
P.O. BOX 3791
ORLANDO, FL 32802-3791

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