Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/07/1998
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Application #:
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08744994
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Filing Dt:
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11/07/1996
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Inventor:
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KEI MURAYAMA
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Title:
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SEMICONDUCTOR DEVICE HAVING CIRCUIT PATTERN ALONG OUTER PERIPHERY OF SEALING RESIN AND RELATED PROCESSES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 711, AZA SHARIDEN, OAZA KURITA |
| NAGANO-SHI, NAGANO 380, JAPAN |
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| STAAS & HALSEY |
| ATTN: H. J. STAAS |
| 700 11TH ST., NW |
| SUITE 500 |
| WASHINGTON, DC 20001 |
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