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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
5744827
Issue Dt:
04/28/1998
Application #:
08753532
Filing Dt:
11/26/1996
Inventors:
DO S. JEONG, MIN C. AN, SEUNG H. AHN, HYEON J. JEONG, KI W. CHOI
Title:
THREE DIMENSIONAL STACK PACKAGE DEVICE HAVING EXPOSED COUPLING LEAD PORTIONS AND VERTICAL INTERCONNECTION ELEMENTS
Assignment: 1
Reel/Frame:
008357/0972Recorded: 02/03/1997Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
JEONG, DO SOO
Exec Dt:
12/09/1996
AN, MIN CHEOL
Exec Dt:
12/09/1996
AHN, SEUNG HO
Exec Dt:
12/09/1996
JEONG, HYEON JO
Exec Dt:
12/09/1996
CHOI, KI WON
Exec Dt:
12/09/1996
Assignee:
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, PALDAL-GU, SUWON-CITY
KYUNGKI-DO, KOREA, REPUBLIC OF
Correspondent:
JONES & VOLENTINE, L.L.P.
RAYMOND C. JONES, ESQ.
11921 FREEDOM DRIVE, SUITE 550
RESTON, VIRGINIA 22090

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