Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/16/1998
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Application #:
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08370048
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Filing Dt:
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01/09/1995
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Inventors:
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THOMAS H. TEMPLETON JR., ROBIN H. HODGE
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Title:
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PACKAGED INTEGRATED CIRCUIT HAVING THERMAL ENHANCEMENT AND REDUCED FOOTPRINT SIZE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2975 STENDER WAY |
| SANTA CLARA, CALIFORNIA 95054 |
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| ALAN H. MACPHERSON |
| SKJERVEN, MORRILL, MACPHERSON, ET AL |
| 25 METRO DRIVE, SUITE 700 |
| SAN JOSE, CA 95110 |
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