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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/07/1998
Application #:
08581021
Filing Dt:
01/03/1996
Inventors:
WILLIAM G. LODER, JOHN F. MCMAHON
Title:
MULTI-CHIP INTEGRATED CIRCUIT PACKAGE
Assignment: 1
Reel/Frame:
007837/0566Recorded: 01/03/1996Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/21/1995
Exec Dt:
12/21/1995
Assignee:
3065 BOWERS AVENUE
SANTA CLARA, CALIFORNIA 95051
Correspondent:
BLAKELY, SOKOLOFF, TAYLOR & ZAFMAN
BEN YORKS
611 ANTON BLVD., STE. 850
COSTA MESA, CA 92626

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