Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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03/23/1999
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Application #:
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08965847
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Filing Dt:
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11/07/1997
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Inventors:
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RICHARD BILLINGS MERRILL, INDERJIT SINGH
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Title:
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BONDING WIRE INDUCTOR FOR USE IN AN INTEGRATED CIRCUIT PACKAGE AND METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2900 SEMICONDUCTOR DRIVE |
| SANTA CLARA, CALIFORNIA 95052 |
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| HICKMAN BEYER & WEAVER, LLP |
| STEVE D. BEYER |
| P.O. BOX 61059 |
| PALO ALTO, CA 94306 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2900 SEMICONDUCTOR DRIVE |
| SANTA CLARA, CALIFORNIA 95052 |
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| HICKMAN BEYER & WEAVER, LLP |
| STEVEN D. BEYER |
| P.O. BOX 61059 |
| PALO ALTO, CA 94306 |
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Assignment:
3
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CORRECTED RECORDATION FORM COVER SHEET TO CORRECT THE STATE OF INCORPORATION, PREVIOUSLY RECORDED AT REEL/FRAME 8809/0360 AND AT REEL/FRAME 8809/0348 (ASSIGNMENT OF ASSIGNOR'S INTEREST)
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| 2900 SEMICONDUCTOR DRIVE |
| SANTA CLARA, CALIFORNIA 95052 |
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| HICKMAN & BEYER |
| STEVE D BEYER |
| P.O. BOX 61059 |
| PALO ALTO, CA 94306 |
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