Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/25/1999
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Application #:
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08849035
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Filing Dt:
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07/02/1997
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Inventors:
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ELKE ZAKEL, ROLF ASCHENBRENNER
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Title:
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SOLDER BUMP FOR FLIP CHIP ASSEMBLY AND METHOD OF ITS FABRICATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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LEONRODSTRASSE 54 |
D-80636 MUNICH, GERMANY |
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KARL HORMANN |
86 SPARKS STREET |
CAMBRIDGE, MA 02138 |
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