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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
5925443
Issue Dt:
07/20/1999
Application #:
07758991
Filing Dt:
09/10/1991
Inventors:
FARID Y. AOUDE, LAWRENCE D. DAVID, RENUKA S. DIVAKARUNI, SHAJI FAROOQ, LESTER W. HERRON et al
Title:
COPPER-BASED PASTE CONTAINING COPPER ALUMINATE FOR MICROSTRUCTURAL AND SHRINKAGE CONTROL OF COPPER-FILLED VIAS
Assignment: 1
Reel/Frame:
005849/0586Recorded: 09/10/1991Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
AOUDE, FARID Y.
Exec Dt:
09/04/1991
DAVID, LAWRENCE D.
Exec Dt:
09/03/1991
DIVAKARUNI, RENUKA S.
Exec Dt:
09/06/1991
FAROOQ, SHAJI
Exec Dt:
09/03/1991
HERRON, LESTER W.
Exec Dt:
09/04/1991
LASKY, HAL M.
Exec Dt:
09/03/1991
MASTREANI, ANTHONY
Exec Dt:
09/04/1991
NATARAJAN, GOVINDARAJAN
Exec Dt:
09/03/1991
REDDY, SRINIVASA S. N.
Exec Dt:
09/03/1991
SURA, VIVEK M.
Exec Dt:
09/03/1991
VALLABHANENI, RAO V.
Exec Dt:
09/03/1991
WALL, DONALD R.
Exec Dt:
09/03/1991
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION A CORP. OF NEW YORK
ARMONK, NEW YORK 10504
Correspondent:
IRA DAVID BLECKER
INTELLECTUAL PROPERTY LAW, IBM CORP.
DEPT. 901, BLDG 300-482, ROUTE 52
HOPEWELL JUNCTION, NY 12533

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