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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/17/1999
Application #:
07984147
Filing Dt:
11/24/1992
Inventors:
DEEPAK MAHULIKAR, JACOB CRANE, ABID A. KHAN
Title:
THERMAL PERFORMANCE PACKAGE FOR INTEGRATED CIRCUIT CHIP
Assignment: 1
Reel/Frame:
009781/0951Recorded: 02/23/1999Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/19/1999
Assignee:
555 CARNEGIE STREET, P.O. BOX 952
MANTECA, CALIFORNIA 95336
Correspondent:
WIGGIN & DANA
GREGORY S. ROSENBLATT
ONE CENTURY TOWER
NEW HAVEN, CT 06508-1832

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