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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
08/24/1999
Application #:
08545388
Filing Dt:
10/19/1995
Inventor:
YIH-SHUNG LIN
Title:
INTEGRATED CIRCUIT WITH PLANARIZED DIELECTRIC LAYER BETWEEN SUCCESSIVE POLYSILICON LAYERS
Assignment: 1
Reel/Frame:
007723/0231Recorded: 10/19/1995Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/11/1995
Assignee:
M/S 2346
1310 ELECTRONICS DRIVE
CARROLLTON, TEXAS 75006
Correspondent:
LISA K. JORGENSON
M/S 2348
1310 ELECTRONICS DRIVE
CARROLLTON, TX 75006-5039
Assignment: 2
Reel/Frame:
010126/0696Recorded: 07/29/1999Pages: 6
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/19/1998
Assignee:
M/S 2346
1310 ELECTRONICS DR.
CARROLLTON, TEXAS 75006
Correspondent:
LISA K. JORGENSON
1310 ELECTRONICS DR., M/S 2346
CARROLLTON, TX 75006-5039

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