Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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08/31/1999
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Application #:
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08768599
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Filing Dt:
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12/18/1996
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Inventors:
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CHUNG-PING CHIEN, JEAN A. NIELSEN, PETER L. YOUNG
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Title:
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FABRICATION PROCESS FOR MULTICHIP MODULES USING LOW TEMPERATURE BAKE AND CURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| M/S 13-08 |
| 7755 E MARGINAL WAY S. |
| SEATTLE, WASHINGTON 98108 |
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| THE BOEING COMPANY |
| THOMAS W. HENNEN-M/S 13-08 |
| 7755 E MARGINAL WAY S. |
| SEATTLE, WA 98108 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2711 CENTERVILLE RD SUITE 400 |
| WILMINGTON, DELAWARE 19808 |
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| STERNE, KESSLER, GOLDSTEIN & FOX P.L.L.C |
| 1100 NEW YORK AVENUE, N.W. |
| WASHINGTON, DC 20005 |
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Assignment:
3
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 2711 CENTERVILLE RD |
| SUITE 400 |
| WILMINGTON, DELAWARE 19808 |
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| STERNE, KESSLER, GOLDSTEIN & FOX P.L.L.C |
| 1100 NEW YORK AVENUE, N.W. |
| WASHINGTON, DC 20005 |
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