Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/14/1999
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Application #:
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08578922
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Filing Dt:
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12/27/1995
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Inventors:
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MICHAEL A. GAYNES, ALAN J. EMERICK, VISWANADHAM PULIGANDLA, CHARLES G. WOYCHIK et al
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Title:
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HIGH DENSITY INTEGRATED CIRCUIT PACKAGING WITH CHIP STACKING AND VIA INTERCONNECTIONS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| OLD ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| WHITHAM, CURTIS, WHITHAM & MCGINN |
| JOYCE KEEN |
| 11800 SUNRISE VALLEY DRIVE |
| SUITE 900 |
| RESTON, VA 22091 |
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