Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/28/2000
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Application #:
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09247230
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Filing Dt:
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02/09/1999
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Inventors:
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TE-SHENG YANG, KAI-KUANG HO
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Title:
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METHOD OF FABRICATING WAFER-LEVEL PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 3, LI-HSIN ROAD II |
| HSINCHU, TAIWAN R.O.C |
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| KNOBBE, MARTENS, OLSON ET AL. |
| LOWELL ANDERSON |
| SIXTEENTH FLOOR |
| 620 NEWPORT CENTER DRIVE |
| NEWPORT BEACH, CA 92660 |
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