Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/09/2001
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Application #:
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09201513
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Filing Dt:
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11/30/1998
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Inventor:
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CHIEN-JUNG WANG
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Title:
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METHOD FOR FORMING A PLANAR INTERMETAL DIELECTRIC USING A BARRIER LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 25, LI-HSIN RD., SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| CHRISTENSEN O'CONNOR JOHNSON ETAL PLLC |
| CHUN M. NG, ESQ. |
| 1420 FIFTH AVENUE, SUITE 2800 |
| SEATTLE, WA 98101-2347 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE-BASED INDUSTRIAL PARK |
| 121, PARK AVE., II |
| HSIN-CHU 300, TAIWAN R.O.C |
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| THOMAS, KAYDEN, HORSTEMEYER, ET AL. |
| DANIEL R. MCCLURE |
| 100 GALLERIA PARKWAY, SUITE 1750 |
| ATLANTA, GA 30339 |
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