Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/16/2001
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Application #:
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09267885
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Filing Dt:
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03/11/1999
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Inventors:
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TAO J. TSENG, DAVID C.H. CHENG
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Title:
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THERMAL VIAS-PROVIDED CAVITY-DOWN IC PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| KENG KOU VILLAGE, LU-CHU |
| NO. 66-6. HOU PI TSO, 9 LIN |
| TAOYUAN HSIEN, TAIWAN R.O.C |
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| J.C. PATENTS, INC. |
| JIAWEI HUANG |
| 1340 REYNOLDS AVE., SUITE 114 |
| IRVINE, CA 92614 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| KENG KOU VILLAGE, LU-CHU COUNTRY |
| NO. 66-6, HOU PI TSO, 9 LIN |
| TAOYUAN HSIEN, TAIWAN R.O.C |
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| THOMAS, KAYDEN, HORSTEMEYER, ET AL. |
| DANIEL R. MCCLURE |
| 100 GALLERIA PARKWAY |
| SUITE 1500 |
| ATLANTA, GA 30339 |
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