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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
02/20/2001
Application #:
08508973
Filing Dt:
07/28/1995
Inventors:
KUEI-WU HUANG, TSIU C. CHAN, JAMIN LING
Title:
METHOD OF FORMING PLANARIZED MULTILEVEL METALLIZATION IN AN INTEGRATED CIRCUIT
Assignment: 1
Reel/Frame:
007600/0290Recorded: 07/28/1995Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/21/1995
Exec Dt:
07/21/1995
Exec Dt:
07/24/1995
Assignee:
1310 ELECTRONICS DR., M/S 2348
CARROLLTON, TEXAS 75006
Correspondent:
LISA K. JORGENSON
M/S 2346
1310 ELECTRONICS DR.
CARROLLTON, TX 75006-5039
Assignment: 2
Reel/Frame:
011192/0046Recorded: 10/02/2000Pages: 6
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/19/1998
Assignee:
M/S 2346
1310 ELECTRONICS DRIVE
CARROLLTON, TEXAS 75006
Correspondent:
LISA K. JORGENSON
1310 ELECTRONICS DRIVE
M/S 2346
CARROLLTON, TX 75006

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