Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/06/2001
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Application #:
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09475003
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Filing Dt:
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12/30/1999
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Inventors:
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CHIEN-PING HUANG, ERIC KO
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Title:
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THERMALLY ENHANCED QUAD FLAT NON-LEAD PACKAGE OF SEMICONDUCTOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.123, TA-FONG RD., TAN-TZU HSIANG |
| TAICHUNG HSIEN, TAIWAN R.O.C |
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| J.C. PATENTS, INC. |
| JIAWEI HUANG |
| 1340 REYNOLDS AVE., SUITE 114 |
| IRVINE, CA 92614 |
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