Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/03/2001
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Application #:
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09400626
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Filing Dt:
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09/20/1999
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Inventor:
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CHINE-GIE LOU
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Title:
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INTERCONNECTION LINES FOR IMPROVING THERMAL CONDUCTIVITY IN INTEGRATED CIRCUITS AND METHOD FOR FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 25, LI-HSIN RD., SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN R.O.C |
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| BAKER & BOTTS, L.L.P. |
| RONALD B. HILDRETH |
| 30 ROCKEFELLER PLAZA - 44 FL. |
| NEW YORK, NY 10112 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE-BASED INDUSTRIAL PARK |
| 121, PARK AVE., II |
| HSIN-CHU 300, TAIWAN R.O.C |
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| THOMAS, KAYDEN, HORSTEMEYER, ET AL. |
| DANIEL R. MCCLURE |
| 100 GALLERIA PARKWAY, SUITE 1750 |
| ATLANTA, GA 30339 |
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