Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/29/2001
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Application #:
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09110787
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Filing Dt:
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07/06/1998
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Inventors:
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JOHN MACPHERSON, WENDY ENG
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Title:
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MODIFIED LEAD FRAME FOR IMPROVED PARALLELISM OF A DIE TO PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2972 STENDER WAY |
SANTA CLARA, CALIFORNIA 95054 |
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SKJERVEN, MORRILL, MACPHERSON, ET AL. |
EDWARD C. KWOK |
25 METRO DRIVE, SUITE 700 |
SAN JOSE, CA 95110 |
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