Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/12/2001
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Application #:
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09026116
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Filing Dt:
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02/19/1998
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Inventors:
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FRANCOIS J. HENLEY, NATHAN W. CHEUNG
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Title:
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ECONOMICAL SILICON-ON-SILICON HYBRID WAFER ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 590 DIVISION STREET |
| CAMPBELL, CALIFORNIA 95008 |
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| TOWNSEND AND TOWNSEND AND CREW LLP |
| SCOTT W. HEWETT |
| TWO EMBARCADERO CENTER, 8TH FLOOR |
| SAN FRANCISCO, CA 94111-3834 |
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