Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/09/2001
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Application #:
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09533078
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Filing Dt:
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03/22/2000
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Inventor:
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Jiromaru Tsujino
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Title:
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Bonding method of electronic parts employing ultrasonic
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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4-5, NEGISHI 3-CHOME, TAITOH-KU |
TOKYO, JAPAN 110-0 |
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ROGERS & KILLEEN |
L. LAWTON ROGERS, III |
510 KING STREET, SUITE 400 |
ALEXANDRIA, VA 22314 |
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