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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/09/2001
Application #:
09397363
Filing Dt:
09/16/1999
Inventor:
SALMAN AKRAM
Title:
STACKED LEADS-OVER-CHIP MULTI-CHIP MODULE
Assignment: 1
Reel/Frame:
023786/0416Recorded: 01/04/2010Pages: 274
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/23/2009
Assignee:
26 DEER CREEK LANE
MT. KISCO, NEW YORK 10549
Correspondent:
CHRISTOPHER C. HENRY
ROPES & GRAY LLP
1211 AVENUE OF THE AMERICAS
NEW YORK, NEW YORK 10036

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