Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/23/2001
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Application #:
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09547157
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Filing Dt:
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04/11/2000
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Inventors:
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Chien-Ping Huang, Randy H Y Lo, Tzong-Da Ho, Jui-Meng Jao, Eric Ko
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Title:
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Method of fabricating a ball grid array integrated circuit package having an encapsulating body
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DA FONG ROAD |
| TANTZU, TAICHUNG, TAIWAN R.O.C |
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| DIKE, BRONSTEIN, ROBERTS & CUSHMAN, LLP |
| PETER F. CORLESS |
| 130 WATER STREET |
| BOSTON, MA 02109 |
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