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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
6323436
Issue Dt:
11/27/2001
Application #:
08833614
Filing Dt:
04/08/1997
Inventors:
JEFFREY C HEDRICK, KOTAS PAPATHOMAS, AMARJIT SINGH RAI, STEPHEN LEO TISDALE et al
Title:
HIGH DENSITY PRINTED WIRING BOARD POSSESSING CONTROLLED COEFFICIENT OF THERMAL EXPANSION WITH THIN FILM REDISTRIBUTION LAYER
Assignment: 1
Reel/Frame:
008769/0350Recorded: 10/14/1997Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HEDRICK, JEFFREY C.
Exec Dt:
08/18/1997
PAPATHOMAS, KOSTAS
Exec Dt:
07/15/1997
RAI, AMARJIT S.
Exec Dt:
07/28/1997
TISDALE, STEPHEN L.
Exec Dt:
07/21/1997
VIEHBECK, ALFRED
Exec Dt:
06/24/1997
Assignee:
IBM CORPORATION
ARMONK, NEW YORK 10504
Correspondent:
IBM CORPORATON
DANIEL P. MORRIS
INTELLECTUAL PROPERTY LAW
P.O. BOX 218
YORKTOWN HEIGHTS, NY 10598
Assignment: 2
Reel/Frame:
009178/0560Recorded: 05/11/1998Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
MAUCH LABORATORIES, INC.
Exec Dt:
05/05/1998
Assignee:
MAUCH, INC.
3035 DRYDEN ROAD
DAYTON, OHIO 45439
Correspondent:
JACOX, MECKSTROTH & JENKINS
ALAN F. MECKSTROTH, ESQ.
2310 FAR HILLS BLDG.
DAYTON, OHIO 45419-1575

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