Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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06/18/2002
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Application #:
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09544701
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Filing Dt:
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04/06/2000
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Inventors:
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Steven J. Brunelle, Phuong A. Nguyen
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Title:
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TEST MODULE FOR MULTI-CHIP MODULE SIMULATION TESTING OF INTEGRATED CIRCUIT PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 900 EAST KARCHER ROAD |
| NAMPA, IDAHO 83687 |
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| TRASK, BRITT & ROSSA |
| KERRY D. TWEET |
| P.O. BOX 2550 |
| SALT LAKE CITY, UT 84110-2550 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1545 BARBER LANE |
| MILPITAS, CALIFORNIA 95035 |
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| MICRON ELECTRONICS, INC. |
| STEVEN P. ARNOLD |
| 900 EAST KARCHER ROAD |
| NAMPA, ID 83687 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8000 SOUTH FEDERAL WAY |
| BOISE, IDAHO 83707-0006 |
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| TRASKBRITT |
| JOSEPH A. WALKOWSKI |
| PO BOX 2550 |
| SALT LAKE CITY, UT 84110 |
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