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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/25/2002
Application #:
09604386
Filing Dt:
06/27/2000
Inventors:
E-June Chen, Bjoern Schenk, Ramesh Bapat, I. Gene Fowkes, Brian Gracias, Shen-Yeh Chen et al
Title:
Low stress connection methodology for thermally incompatible materials
Assignment: 1
Reel/Frame:
010920/0884Recorded: 06/27/2000Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/26/2000
Exec Dt:
05/31/2000
Exec Dt:
05/31/2000
Exec Dt:
05/06/2000
Exec Dt:
05/26/2000
Exec Dt:
05/26/2000
Exec Dt:
05/24/2000
Exec Dt:
05/31/2000
Assignee:
LAW DEPARTMENT AB2
101 COLUMBIA ROAD, P.O. BOX 2245
MORRISTOWN, NEW JERSEY 07962
Correspondent:
HONEYWELL INTERNATIONAL INC.
ROBERT DESMOND
LAW DEPARTMENT AB2
P.O. BOX 2245
MORRISTOWN, NJ 07962-9806

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