Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/02/2002
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Application #:
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09429045
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Filing Dt:
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10/29/1999
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Inventor:
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ANTHONY M. CHIU
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Title:
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LOW STRESS AND LOW PROFILE CAVITY DOWN FLIP CHIP AND WIRE BOND BGA PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1310 ELECTRONICS DRIVE |
| CARROLLTON, TEXAS 75006 |
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| FELSMAN, BRADLEY, VADEN ET AL. |
| DAN VENGLARIK |
| 201 MAIN STREET |
| SUITE 1600 |
| FORT WORTH, TX 76102 |
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