Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/16/2002
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Application #:
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09477350
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Filing Dt:
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01/04/2000
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Inventors:
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EDUARD RAYMOND LEUENBERGER, DENNIS LAU CHEUK-PING
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Title:
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SEMICONDUCTOR PACKAGE AND ENHANCED FBG MANUFACTURING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6/F HALE WEAL INDUSTRIAL BUILDING 22-28 TSUEN WAN |
| NEW TERRITORIES, HONG KONG |
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| STERNE, KESSLER ET AL |
| DONALD J. FEATHERSTONE, ESQ. |
| 1100 NEW YORK AVE., N.W. |
| SUITE 600 |
| WASHINGTON, D.C. 20005-3934 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6/F, HALE WEAL INDUSTRIAL BUILDING, 22-28 TAI CHUNG ROAD |
| TSUEN WAN, HONG KONG, CHINA |
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| STERNE, KESSLER, GOLDSTEIN & FOX, PLLC |
| C/O EDWARD J. KESSLER |
| 1100 NEW YORK AVE., N.W., SUITE 600 |
| WASHINGTON, D.C. 20005-3934 |
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