Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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08/06/2002
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Application #:
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09032191
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Filing Dt:
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02/27/1998
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Publication #:
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Pub Dt:
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05/09/2002
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Inventors:
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JERROLD L. KING, JERRY M. BROOKS
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Title:
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MULTICHIP SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8000 SOUTH FEDERAL WAY |
| BOISE, IDAHO 83707 |
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| WORKMAN, NYDEGGER & SEELEY |
| BRADLEY K. DESANDRO |
| 60 EAST SOUTH TEMPLE |
| 1000 EAGLE GATE |
| SALT LAKE CITY, UT 84111 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HWA-YA TECHNOLOGY PARK NO. 669, FUHSING 3 RD |
| KUEISHAN, TAOYUAN, TAIWAN |
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| DORSEY & WHITNEY LLP - IP DOCKET DEPT. |
| 701 FIFTH AVENUE |
| SUITE 6100 |
| SEATTLE, WA 98104-7043 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HWA-YA TECHNOLOGY PARK NO. 669, FUHSING 3 RD |
| KUEISHAN, TAOYUAN, TAIWAN |
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| DORSEY & WHITNEY LLP - IP DOCKET DEPT. |
| 701 FIFTH AVENUE |
| SUITE 6100 |
| SEATTLE, WA 98104-7043 |
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