Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/10/2002
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Application #:
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09382436
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Filing Dt:
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08/25/1999
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Publication #:
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Pub Dt:
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03/14/2002
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Inventors:
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TSUNG-CHIEH CHEN, CHUN-LIANG CHEN
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Title:
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METHOD FOR FABRICATING A DUAL-CHIP PACKAGE AND PACKAGE FORMED
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE-BASED INDUSTRIAL PARK |
| 123 PARK AVENUE - 3RD |
| HSINCHU, TAIWAN 30077 |
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| TUNG & ASSOCIATES |
| RANDY W. TUNG |
| 838 W. LONG LAKE ROAD |
| SUITE 120 |
| BLOOMFIELD HILLS, MICHIGAN 48302 |
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