Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/03/2002
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Application #:
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09685433
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Filing Dt:
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10/10/2000
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Inventors:
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Ying Chou Tsai, Shih Kuang Chiu
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Title:
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FLIP-CHIP PACKAGING PROCESS UTILIZING NO-FLOW UNDERFILL TECHNIQUE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 123, SEC. 3 |
DA FONG RD., TANTZU |
TAICHUNG, TAIWAN |
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EDWARDS & ANGELL LLP |
PETER F. CORLESS |
130 WATER STREET |
BOSTON, MA 02109-4280 |
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