Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/03/2003
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Application #:
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10128272
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Filing Dt:
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04/24/2002
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Inventors:
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James Chen, Rong-Huei Wang
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Title:
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BALL GRID ARRAY SEMICONDUCTOR PACKAGE WITH RESIN COATED METAL CORE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4F. NO. 22, TAIYUEN ST., CHUPEI |
| HSINCHU SCHIEN, TAIWAN R.O.C |
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| ROSENBERG, KLEIN & LEE |
| MORTON J. ROSENBERG |
| 3458 ELLICOTT CENTER DRIVE, SUITE 101 |
| ELLICOTT CITY, MD 21043 |
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