Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/15/2003
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Application #:
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10001862
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Filing Dt:
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11/19/2001
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Publication #:
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Pub Dt:
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04/04/2002
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Inventors:
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Chien-Ping Huang, Chih-Chin Liao, Yung-Kang Chu
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Title:
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CHIP PACKAGE CAPABLE OF REDUCING MOISTURE PENETRATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DA FONG RD. |
| TANTZU TAICHUNG R.O.C., TAIWAN |
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| KLARQUIST SPARKMAN, LLP |
| STACEY C. SLATER, ESQ. |
| ONE WORLD TRADE CENTER, SUITE 1600 |
| 121 S.W. SALMON STREET |
| PORTLAND, OR 97204-2988 |
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