Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/22/2003
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Application #:
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10035209
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Filing Dt:
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01/04/2002
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Publication #:
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Pub Dt:
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07/10/2003
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Inventors:
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James C. Matayabas JR., Paul Koning, Jinlin Wang
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Title:
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ELECTRONIC PACKAGES HAVING GOOD RELIABILITY COMPRISING LOW MODULUS THERMAL INTERFACE MATERIALS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD, SC4-202 |
| SANTA CLARA, CALIFORNIA 95052 |
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| ANTONELLI, TERRY, STOUT & KRAUS, LLP |
| RONALD J. SHORE |
| 1300 NORTH 17TH STREET, STE. 1800 |
| ARLINGTON, VA 22209 |
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